Design Issues and Considerations for Low-Cost 3-D TSV IC Technology
نویسندگان
چکیده
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ژورنال
عنوان ژورنال: IEEE Journal of Solid-State Circuits
سال: 2011
ISSN: 0018-9200,1558-173X
DOI: 10.1109/jssc.2010.2074070